DPC ceramic submounts & substrates
AlN and Alumina DPC Submounts for Laser Diodes, Silicon Photonics, LiDAR and TEC
Direct plated copper (DPC) ceramics built to your drawing, with fine-line patterning, high thermal conductivity and a stable supply. Our North American contact is in Markham, Ontario, and we quote in USD.
- 20+ years of team experience in ceramic metallization
- Built to customer drawings
- Engineering samples & small lots
- NDA on request
- Quotes in USD
Where our DPC ceramics are used
DPC builds copper patterns directly on AlN or alumina: a PVD-sputtered seed layer, photolithographic patterning, then pattern plating to full copper thickness. You get finer features and tighter registration than thick-film or DBC, which suits small, heat-dense optoelectronic packages.
Laser diode submounts
AlN submounts, laser carriers and heat sinks for EML, DFB and high-power CW laser chips.
- High thermal conductivity under the active region
- CTE closer to InP / GaAs than metal carriers
- Patterned pads for die attach and wire bond
Silicon photonics & CPO
Ceramic carriers and interposer-style substrates for laser sources and optical engines, with thin-film resistors available on request.
- Fine-line routing for RF / bias
- Flat surfaces for passive alignment
- Prototype to volume
LiDAR emitters
Substrates for pulsed laser arrays and VCSEL / edge-emitter modules.
- Heat spreading for high peak power
- Multi-channel pad layouts
- Automotive-oriented programs
Thermoelectric coolers (TEC)
Patterned alumina and AlN plates for Peltier modules and micro-TECs.
- Copper pad arrays to your layout
- Solderable finishes
- Consistent flatness across the panel
DPC capabilities
These are typical values. Final specs are confirmed for each part number after DFM review of your drawing.
| Parameter | Typical | Notes |
|---|---|---|
| Ceramic material | Aluminum nitride (AlN), 96% alumina (Al₂O₃) | Silicon nitride (Si₃N₄) and other ceramics on request |
| Thermal conductivity | AlN ≈ 170 W/m·K · Al₂O₃ ≈ 24 W/m·K | Choose AlN for heat-dense laser / TEC designs |
| Process | DPC (direct plated copper): PVD sputtered seed layer → photolithography → pattern plating | Semi-additive build gives straight sidewalls and accurate pad geometry. DBC / AMB available for power-module designs |
| Copper thickness | 1–2 oz (≈ 35–70 µm) | Thinner copper can be discussed for fine-line patterns |
| Patterning | Photolithographic, double-sided · line / space from ≈ 100 µm (0.1 mm) | Finer line / space depends on copper thickness, confirmed per drawing |
| Vias | Plated / filled through-vias | Diameter and pitch confirmed per drawing |
| Surface finish | To your specification | Tell us your die-attach and wire-bond process |
| Singulation | Laser scribing / dicing to final size | Typical size tolerance ±0.10 mm, tighter confirmed per drawing |
AlN substrate properties (typical)
| Property | Value | Property | Value |
|---|---|---|---|
| Thermal conductivity | ≥ 170 W/m·K | CTE (20–300 °C) | 4.6 ppm/K |
| Dielectric constant (1 MHz) | 9 | Dielectric loss (1 MHz) | 3.8 × 10⁻⁴ |
| Volume resistivity | > 10¹³ Ω·cm | Dielectric strength | 17 kV/mm |
| Density | ≥ 3.30 g/cm³ | Flexural strength | 320–330 MPa |
| Surface roughness Ra | 0.3–0.5 µm (polished ≤ 0.1 µm) | Camber | 0.03–0.05 per 25 mm |
AlN's CTE sits close to Si and GaAs, which reduces die-attach stress on laser and photonic chips. Not sure whether DPC or DBC fits your design? Send your stack-up and heat-load target and we will recommend one.
From drawing to parts
A simple path for engineering and procurement teams.
Send your drawing
Upload a PDF, DXF or STEP file, or just a sketch with key dimensions. We can sign your NDA first.
DFM review & quote
We confirm feasibility, flag risks and quote in USD with lead time, within 1 business day.
Engineering samples
A small sample lot for your qualification, with an inspection report.
Volume supply
Repeat orders on a locked spec, with a single contact in North America.
FAQ
What copper thickness do you offer on DPC?
Typical DPC copper is 1–2 oz (about 35–70 µm). Thinner copper can be discussed for fine-line patterns.
Do you make small quantities for prototypes?
Yes. Engineering samples and small lots are welcome, and volume pricing follows once the design is frozen.
Can you match a specific finish or solder pre-deposit, such as AuSn (Au80Sn20)?
Send us your die-attach and wire-bond requirements. Finish and solder pre-deposit options, including AuSn, are confirmed per project during the DFM review before quoting.
Can you work under NDA?
Yes. We can sign your mutual NDA before you share drawings.
Who will I be dealing with?
A team with more than 20 years of experience in ceramic metallization. North American customers are served by Cerametronics International Inc. in Markham, Ontario, Canada, and quotes are in USD.
Request a DPC quote
Share your material, dimensions and volume. We reply with a DFM review, pricing and lead time.
Email: [email protected]
Phone: +1 (289) 800-7163
North America office:
2800 John Street, Markham, ON L3R 0E2, Canada